Intel Provides Details On New Products

Intel Corporation has detailed more than 20 new products, technology innovations and industry initiatives -- many of them industry firsts -- aimed at making the World Wide Web, computers and consumer electronics devices much more responsive, friendlier and secure.

Under the backdrop of Intel's leadership in 45nm Hi-k metal gate silicon technology and how it will ignite new innovation and growth opportunities, Intel executives at the Intel Developer Forum disclosed new performance details for its next-generation "Penryn" processor family. The company also unveiled two product roadmaps for Intel architecture (IA)-based System on Chip (SOC) consumer electronic (CE) devices and business uses.

"Welcome to the era of multicore, an era in which all of our computing capabilities will multiply our own personal capabilities," said Justin R Rattner, Intel's chief technology officer. "This Beijing developer forum will show how our multiple innovations go hand in hand with evolutions in social networking, PC and TV entertainment, online commerce and other growing demands on the internet. Today, Intel is delivering a breadth of multicore processors worldwide and a product roadmap providing the incredible performance boost and energy efficiency needed to put the consumer more in control of the information age."

The IDF is being held for the first time in Beijing. Last month, Intel announced plans to invest $2.5 billion to build China's first 300mm wafer fabrication facility in the city of Dalian.








Added on April 23, 2007 Comment

Why don't you rate this content?

Article rating -- None Bookmark and Share


Comments

Post a comment